Forschungsbericht 2021
Theoretische Elektrotechnik E-18
Leitung: Prof. Dr. sc. techn. Christian Schuster
Institut auf TORE
Institutswebsite
Publikationen
- Improving accuracy after stability enforcement in the Loewner matrix framework - Article
Carrera-Retana, Luis Ernesto; Marin-Sanchez, Mario; Schuster, Christian; Rimolo-Donadio, Renato
IEEE Transactions on Microwave Theory and Techniques 70 (2) : 1037-1047 (2022)
Publisher DOI
- Analysis and Optimization of Nonlinear Diode Grids for Shielding of Enclosures With Apertures - Article
Yang, Cheng; Wendt, Torben; De Stefano, Marco; Kopf, Marc; Beck, Christopher; Grivet-Talocia, Stefano; Schuster, Christian
IEEE Transactions on Electromagnetic Compatibility 63 (6): 1884-1895 (2021-12-01)
Publisher DOI
- Integrierte optoelektronische Systeme basierend auf hochempfindlichen Einzelphotonendetektoren für optogenetische Anwendungen - inProceedings
Singer, Julian; Geläschus, Anton; Schuster, Christian; Trieu, Hoc Khiem; Kuhl, Matthias
Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte für zukunftsfahige Markte - MikroSystemTechnik Congress (2021)
- Distributed Nonlinear Shielding in Power Delivery Networks on Printed Circuit Boards - Article
Wendt, Torben; Yang, Cheng; Schuster, Christian; De Stefano, Marco; Grivet-Talocia, Stefano
IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2021)
Publisher DOI
- Evaluation of Support Vector Machines for PCB based Power Delivery Network Classification - inProceedings
Schierholz, Morten; Hassab, Youcef; Yang, Cheng; Schuster, Christian
IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2021)
Publisher DOI
- Efficient and Flexible Huygens' Source Replacement of mm-scale Human Brain Implants - inProceedings
Yang, Cheng; Schierholz, Christian Morten; Trunczik, Eileen; Helmich, Leon Maximilian; Brüns, Heinz-Dietrich; Schuster, Christian
Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe (EMC/SI/PI/EMC Europe 2021)
Publisher DOI
- ANN Hyperparameter Optimization by Genetic Algorithms for Via Interconnect Classification - inProceedings
Sanchez-Masis, Allan; Carmona-Cruz, Allan; Schierholz, Christian Morten; Duan, Xiaomin; Roy, Kallol; Yang, Cheng; Rimolo-Donadio, Renato; Schuster, Christian
IEEE Workshop on Signal and Power Integrity (SPI 2021)
Publisher DOI
- Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics - inProceedings
Yildiz, Ömer Faruk; Pathe, Nico; Bochard, Marc; Yang, Cheng; Schuster, Christian
IEEE Workshop on Signal and Power Integrity (SPI 2021)
Publisher DOI
- Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer Substrates - Article
Yildiz, Ömer Faruk; Thomsen, Ole; Bochard, Marc; Yang, Cheng; Schuster, Christian
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 (4): 9383282 (2021-04)
Publisher DOI
- Numerical Analysis of Two MIMO Channels Carrying Orbital Angular Momentum (OAM) - inProceedings
Wang, Lei; Wulff, Michael; Yang, Cheng; Schuster, Christian
European Conference on Antennas and Propagation (EuCAP 2021)
Publisher DOI
- A multistage adaptive sampling scheme for passivity characterization of large-scale macromodels - Article
De Stefano, Marco; Grivet-Talocia, Stefano; Wendt, Torben; Yang, Cheng; Schuster, Christian
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 (3): 9345758 (2021-03-01)
Publisher DOI
- SI/PI-database of PCB-based interconnects for machine learning applications - Article
Schierholz, Christian; Sanchez-Masis, Allan; Carmona-Cruz, Allan; Duan, Xiaomin; Roy, Kallol; Yang, Cheng; Rimolo-Donadio, Renato; Schuster, Christian
IEEE Access 9: 9361755 (2021-02-24)
Open Access Publisher DOI
- Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently - Article
Yildiz, Ömer Faruk; Pathe, Nico; Bochard, Marc; Yang, Cheng; Schuster, Christian
IEEE Electromagnetic Compatibility Magazine 10 (4): 35-45 (2021-02-11)
Publisher DOI
- Vertically Integrated Microwave-Filters Using Functional Via Structures in LTCC - inProceedings
Yildiz, Ömer Faruk; Thomsen, Ole; Bochard, Marc; Yang, Cheng; Schuster, Christian
50th European Microwave Conference (EuMC 2020)
Publisher DOI
- Macromodeling of Mutual Inductance for Displaced Coils Based on Laplace's Equation - Article
Weber, Harry; Baran, Harun; Utermöhlen, Fabian; Schuster, Christian
IEEE Transactions on Instrumentation and Measurement 70: 9369314 (2021)
Publisher DOI
Projekte
- Eigenschaften von Wellen mit Orbital Angular Momentum (OAM) in Bezug auf drahtlose Kommunikation in komplexer Umgebung und auf elektromagnetische Interferenz
Deutsche Forschungsgemeinschaft (DFG); Laufzeit 2020 - 2023
Projektleitung: Schuster, Christian
Co-Projektleitung: Yang, Cheng
Mitarbeitende: Wulff, Michael
- I³-Lab - HELIOS: Hamburg Electronics Lab for Integrated Optoelectronical Systems
Technische Universität Hamburg; Laufzeit 2019 - 2022
Projektleitung: Trieu, Hoc Khiem; Kuhl, Matthias; Eich, Manfred; Schuster, Christian
Mitarbeitende: Gomberg, Ilja
Kooperationspartner
- Bosch
- Cisco
- Frauenhofer IZM, RF & Smart Sensor Systems
- Georgia Tech, 3D Systems Packaging Research Center (PRC)
- Ghent University, IDLAB- Internet Technology and Data Science Lab
- Hella
- Heriot Watt Universität, Institute of Sensors, Signals & Systems
- IBM Deutschland Research & Development GmbH
- IETR, L’Institut d’Électronique et des Technologies du numéRique
- KOA Europe GmbH
- Missouri University of Science and Technology, Electromagnetic Compatibility Laboratory
- Nexperia
- Philips Research Hamburg
- Politecnico di Milano, Electronics& Informatics and Bioengineering Department
- Politecnico di Torino, Electronics and Telecommunications Department/ EMC Group
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Tecnológico de Costa Rica (TEC), Electronics Engineering Department
- University of Tartu, Institute of Computer Science
- University of Toronto, Electrical & Computer Engineering
